PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/623116

Contents of this Issue


Page 33 of 79

34 The PCB Magazine • January 2016 compression bonding was predicted to become the foundation for most of future advanced packaging platforms, essential for pitch reduc- tion and offering cost savings and improved electrical performance. Technologies such as in- tegrated fan-out package-on-package wafer-lev- el packaging were ex pected to feature in next- generation smartphones, with the scope to in- corporate processor and memory in one pack- age. And developments in substrate-less pack- ages posed a potential threat to the package substrate manufacturing industry, which was FACING INCREDIBLE TIMES: ROBIN TAYLOR'S VISION OF THE FUTURE Figure 1: technology is important—but cost is king! Figure 2: long-term market growth will be dominated by mobile, medical/wearables and the iot. Feature

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB-Jan2016