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Page 46 of 79

Introducing SH-260, a new Polyimide system with Tg > 250°C (TMA) that provides ULTRA HIGH THERMAL PERFORMANCE MAINTAINS 85% FLEXURAL STRENGTH UNDER 200°C MAINTAINS 80% PEEL STRENGTH UNDER 180°C Burn-in boards Down Hole Aircraft and Aerospace Ultra-high count layer boards Other PCB high temperature/ long-duration applications SH-260 IS IDEAL FOR:

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