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January 2016 • The PCB Magazine 73 The Manufacture of Laminate and Prepreg (Bondply) The manufacture of rigid base material is well known. It applies to high-performance laminates as well and is briefly outlined as fol- lows: The resin is typically a thermoset resin. Resin and curing agent(s) are premixed and dis- solved to low boiling solvents (ketones, esters, alcohols) and placed in a trough through which a continuous glass fabric cloth is guided. The dissolved resin, and dispersed fillers as may be the case, coat the glass fabric which travels up a treating tower through different temperature zones where the resin is thermally, partially cured to form the prepreg. The solvent is evapo - rated and the dry prepreg is then rolled up into large rolls. It is then cut up into sheets. It should be noted that a solventless prepreg process is also commercial. The prepreg is then laid-up by sandwiching it between copper sheets that have been cut from a large roll of copper foil. Several of these packages are placed into the chambers of a lamination press where the cop - per clad laminate is formed by fully curing the resin and bonding it to the copper in a process specific time/temperature/pressure profile. Af- ter the lamination process, the large CCL pieces are routed into smaller panels. The edges of the panels are beveled for cleaner processing. Circu- itized panels (innerlayer) may then be laid up to multilayers by alternating prepreg layers with in- nerlayers, topping the multilayer with a cap foil karl's tech talk HIGH-PERFORMANCE LAMINATES