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4 SMT Magazine • February 2016 This issue of SMT Magazine features the latest technology and process developments hap- pening in the SMT, PCB assembly and EMS industries, and what to expect in the future. What's New? New Year Outlook: Electronics Hardware by Dr. Jennie S. Hwang High-Reliability Interconnects for High-Power LED Assembly by Ravi M. Bhatkal, Ph.D. EMS: Quo Vadis? (Where are you Going?) by Frederick Blancas Two-Print Stencil Solutions for Flip Chip/SMT Assembly by William Coleman Challenges and Opportunities for Smaller EMS for Onshoring by Gary Tanel Efficiency, Energy and Convenience: Driving New Solutions and Markets Interview with Craig Hunter Greener Cleaning by Mike Konrad Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking by Dr. S. Manian Ramkumar 12 16 24 32 36 42 46 50 February 2016 • Featured Content 16 42 46 32 24 M A G A z I N E

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