Issue link: https://iconnect007.uberflip.com/i/634491
Interconnecting WLP, MEMS & 2.5/3D Integration San Jose, California, USA October 18 - 20, 2016 SMTA and Chip Scale Review are pleased to announce the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer- level, 3D, TSV, and MEMS device packaging. Call for Papers Submit your abstract online by April 15 www.iwlpc.com Suggested Topics to Submit Wafer Level Packaging MEMS Packaging 3-D Package Integration Other Semi-Conductor Packaging Topics For more information, please contact: Jenny Ng at jenny@smta.org | 952-920-7682