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60 The PCB Magazine • February 2016 demands for fine patterned packaging applica- tions which require smaller than 25 mm vias, even on multi-beam UV/CO 2 platforms. Because of the changing needs for lasers within a PCB facility, equipment that can evolve as process technology advances is always a good choice. An industrial platform that can be tailored to the specific needs of one's pro- cesses and outfitted for maximum production would be the most versatile. This would include a system that can be equipped with a variety of laser sources, including UV, CO 2 , IR and green at various pulse widths. PCB Osamu Sekine is president of nano System Inc. Figure 3: a) 25 mm diameter microvia on glass-filled resin; b) 25 mm/2 mm, top/bottom through-hole via on polyamide material. A textbook-in-progress, authored by industry veteran Happy Holden and writ- ten specifically for engineers and those who want a better understanding of engineering best practices, is available on the pages of the I-Connect007 Daily newsletter on the third Wednesday of each month. (Click here to become a subscriber.) What started with an introductory article, 25 Essential Skills for Engineers, published in the Janu- ary issue of The PCB Magazine, is now being de- veloped into a long-term series that will appear monthly over the next 18 months. In this series, Happy will cover everything from problem solving, DoE, and technical writing, to roadmap- ping, economics, and business plans— especially targeted to engineers. From "The need for Total Quality Control (Six Sigma and Statistical Tools), Part 1": "Continuous improvement must deal not only with improving results, but more importantly with improving capabilities to produce better results in the future. The five major areas of focus for capability improvement are demand gen - eration, supply generation, technology, operations and people capability." Columns may also be accessed through Happy's columnist page by clicking here. Coming Soon: 25 Essential Skills for Engineers, by Happy Holden the next step: teChnology that's driving sMaller MiCrovias

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