Issue link: https://iconnect007.uberflip.com/i/636678
16 The PCB Magazine • February 2016 is arguably the simpler process of the two and it is finding increased use as Tatsuta builds on the 11 patents related to ALIVH technology, which were acquired by and transferred to Tatsuta from Panasonic last year. However, the metal paste's application is not limited and can serve other important functions as well. This will be discussed in more detail after this brief discussion of Tatsuta's conductive mate - rial applied to layer-to-layer interconnection applications. Two basic types of paste have been devel- oped for use as conductive materials for vias in printed circuit production. The first is re- ferred to as a metallized paste which is com- prised of a mixture of low and high melting point powders in a binder material. In the lamination process the different materials new Material and proCess solutions for the eleCtroniC interConneCtion industry Figure 4: Via paste materials MP series and AE series have differing means of making interconnection between layers. The MP material has a nominal final volume resistivity of 8.0 x 10 -5 Ω˓cm while the AP material is slightly higher, on the order of 1.0 x 10 -4 Ω˓cm.