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20 The PCB Magazine • February 2016 on the through-holes during the soldering pro- cess. However, via filling is not limited to pro- tecting the through-holes; it can also be used to help improve heat transfer from high operating temperature components during operation. Tat- suta has developed a range of pastes both non- conductive and conductive to fill both poten- tial needs. These are shown in Figure 5 and the thermal performance of an AE series material in managing heat generated on a test vehicle is shown in Figure 6. ESD/EMI/Controlled Impedance Materials In addition to the many materials dis- cussed, there is one more product that is wor- thy of inclusion in this brief overview of Tat- suta's material and process offerings to printed circuit manufacturers. Included in this group is a range of materials generally provided in film form specially developed to manage ESD and EMI challenges, as well as some applications where controlled impedance is required. The general product set is laid out in Figure 7. It is simple and descriptive but it belies the nu - ance capabilities of the many materials avail- able. The range of material includes various conductive, anisotropically conductive and non-conductive films and includes both ther- mal setting and pressure sensitive application methods. Figure 7: Tatsuta has developed and is making available to designers and producers a wide range of film type products in the areas defined above suitable for both rigid and flexible circuit construction and protection as illustrated. new Material and proCess solutions for the eleCtroniC interConneCtion industry