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22 The PCB Magazine • February 2016 Figure 8: Illustrated are examples of the many important and enabling materials the company has developed. Also shown is how they are presently being used by current customers. Summary The electronics interconnection industry is constantly being challenged by new designs and new design requirements. The set of materi- als in general use today are still suited for many applications but not all. New materials and processes are going to be required in the com- ing years. What has been offered to the reader is an opportunity to get a glimpse of some of the many new and enabling materials that are presently available and to appreciate better how they might be applied to present and future circuit design and fabrication challenges. How they might be used in some present design ap- plications is illustrated in Figure 8. Acknowledgement The author would like to acknowledge the assistance of Tatsuta GM Mike Sakaguchi in making available much of the technical content in this article. For more information on Tatsuta, click here. PCB Joe Fjelstad is founder and CEo of Verdant Electronics and is an inter- national authority and innovator in the field of electronic interconnec- tion and packaging technologies with more than 150 U.S. patents issued or pending. To reach Fjelstad, click here. new Material and proCess solutions for the eleCtroniC interConneCtion industry