Introducing SH-260, a new Polyimide
system with Tg > 250°C (TMA) that provides
ULTRA HIGH THERMAL PERFORMANCE
MAINTAINS 85% FLEXURAL
STRENGTH UNDER 200°C
MAINTAINS 80% PEEL
STRENGTH UNDER 180°C
Burn-in boards
Down Hole
Aircraft and Aerospace
Ultra-high count layer boards
Other PCB high temperature/
long-duration applications
SH-260 IS IDEAL FOR:
