Design007 Magazine

Introducing SH-260, a new Polyimide system with Tg > 250°C (TMA) Visit us at IPC APEX Booth 741 ULTRA HIGH THERMAL PERFORMANCE Burn-in boards Down Hole Aircraft and Aerospace Ultra-high count layer boards Other PCB high temperature/ long-duration applications SH-260 IS IDEAL FOR: CLICK HERE TO LEARN MORE

• Cover
• Feature Content — What's New in PCB Design?
• More Content
• Column — A Tale of Two Shows
• Feature Interview — Technology Outlook with Mentor Graphics
• Feature Interview — What's New at Pulsonix?
• Feature Interview — What's New at Zuken?
• Short — Students Invent Alarm that Protects Your Unattended Bag
• Feature Interview — What's New at DownStream Technologies
• Short — Memristors: Making a New Generation for Digital Memory and Computation
• Feature Interview — What's New at Cadence Design Systems
• Short — You'll Never Be-Leaf What Makes up This Battery
• PCB007 Highlights
• Column — Faster than a Speeding Bullet
• Short — Scientists Bridge Different Materials by Design
• Column — How to Design-Out Production Problems
• Column — Multilayer PCB Bonding Materials for High-Frequency Applications
• MilAero007 Highlights
• Special Section — NAMM 2016 Review
• Article — The Gerber Guide, Chapter 6
• Top Ten Recent Highlights from PCBDesign007
• Events Calendar
• Advertiser Index and Masthead
• Back Cover