SMT007 Magazine

April 2016 • SMT Magazine 89 consisTEnT conTrol ovEr ThE sElEcTivE soldErinG ProducTion ProcEss Figure 15: MCA solder pot temperature. Pp = 5.88—well above 1.66. Figure 16: Ishikawa diagram for wave height.

• Cover
• Featured Content — Pocess Engineering
• More Content
• Column — Taking the Gremlins out of Your Process
• Short — Are You Considering Further Automating the Control of Your Processes?
• Feature — In a Culture of Continuous Improvement, Processes Continually Improve
• Column — Cost vs. Cause: What is More Critical to EMS Profitability?
• Short — Producing Electronics without Semiconductors is Now a Reality
• Supply Lines Highlights
• Feature — Best-Practice Process Preparation for PCB Assembly
• Short — Manufacturing Method for Batteries with Organic Electrode Materials
• Column — To Outsource or Not to Outsource PCB Rework
• MilAero007 Highlights
• Feature — Benefits of Improving Reflow and Screen Printing Processes
• Column — The Importance of Being Earnest (Educated)
• Short — New Research Ensures Car LCDs Work in Extreme Cold, Heat
• EIN Market Highlights
• Feature Interview — Enabling Process Innovation through Test and Measurement Solutions
• Column — Selecting a Selective Soldering System, Part 1
• Feature — Achieving Repeatable, Consistent Control over the Selective Soldering Production Process
• Short — New Terahertz Source Could Strengthen Sensing Applications
• Article — Case Study: Working Smarter Through a Proprietary Systems Strategy
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead
• Back Cover