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April 2016 • The PCB Magazine 81 tests which will conclude in the first quarter of 2016. Based on these Arrhenius plots, Laminate D appears to be the most robust laminate over time and at higher temperatures while Laminate A is the least robust laminate. Although laminate B appears to maintain its dielectric breakdown strength at high temperature, it was found to be mechanically unstable in HATS testing and had many plated-through hole failures before 500 cycles. A modified version of laminate B was retested in HATS and it passed 1000 cycles. Based on these Arrhenius plots laminate D is the most ro- bust laminate over time and at higher temperatures while lami- nate A is the least robust. While laminate B appears to maintain its dielectric breakdown strength at high temperature, it was mechanically unstable during initial HATS testing. Modified laminate B which is currently being tested in the two-year test, passed 1000 cycles HATS. Maximum operating temperature ob- tained by extrapolating each line to 100,000 hours is presented in the Table 12 below for each laminate. Table 12: Calculated maximum operating Temperatures for each laminate Based on Data Collected to Date. (Results from T1 and T2 will be incorporated once testing is completed.) Table 13: Summary of Results. long-term thermal reliability of pCb materials