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36 The PCB Magazine • June 2016 e'less copper IC—a new, vertical electroless cop- per bath developed for high-end IC substrate manufacturing—in a mass production environ- ment in Japan. The aspect ratios of the wedges are 1:0.3 (8 µm width × 2 µm depth). By ap- plying the measurement method A as described above, the throwing power is approximately 80% in the wedges. Figure 7 illustrates a statistical evaluation of a throwing power comparison line test of the new e'less copper IC and a reference bath estab- lished in mass production at several major IC HIGH-THROW ELECTROLESS COPPER—NEW OPPORTUNITIES FOR IC SUBSTRATES AND HDI MANUFACTURING Figure 6: SEM Images of a BMV (60 × 40 µm) on ABF GX-92 treated with e'less copper IC. Figure 7: Statistical evaluation of a comparison line test of e'less copper IC and the reference bath.