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July 2016 • SMT Magazine 113 flip chips," in 32nd International Spring Semi- nar on Electronics Technology, 2009. ISSE 2009, 2009, pp. 1–6. [9] R. Bunea, P. Svasta, Z. Illyefalvi-Vitez, R. Batorfi, and A. Geczy, "Optimizing laser solder- ing of SMD components: From theory to prac- tice," in Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th Interna- tional Symposium for, 2011, pp. 55–58. [10] S. M. Naveed and R. L. Woods, "Diode laser soldering: a lumped parameter mathemati- cal model and comparison of different optical soldering technologies," 2003, vol. 4973, pp. 142–157. [11] R. Durairaj, S. Ramesh, S. Mallik, A. Se- man, and N. Ekere, "Rheological characterisa- tion and printing performance of Sn/Ag/Cu sol- der pastes," Materials & Design, vol. 30, no. 9, pp. 3812–3818, Oct. 2009. [12] S. S. Zhang, Y. J. Zhang, and H. W. Wang, "Effect of particle size distributions on the rhe- ology of Sn/Ag/Cu lead-free solder pastes," Ma- terials & Design, vol. 31, no. 1, pp. 594–598, Jan. 2010. [13] N.-C. Lee, "6 – SMT Problems During Reflow," in Reflow Soldering Processes, Burling- ton: Newnes, 2001, pp. 107–142. [14] D. Manjunath, S. Iyer, S. Eckel, P. Damo- daran, and K. Srihari, "Minimizing flux spatter during lead-free reflow assembly," Soldering & Surface Mount Tech, vol. 18, no. 3, pp. 19–23, Jul. 2006. [15] J. Liu, H. Ma, S. Li, J. Sun, A. Kunwar, W. Miao, J. Hao, and Y. Bao, "The study of in- terficial reaction during rapidly solidified lead- free solder Sn3.5Ag0.7Cu/Cu laser soldering," in 2014 15th International Conference on Elec- tronic Packaging Technology (ICEPT), 2014, pp. 949–952. Watson Tseng is the general manager of Shenmao America Inc. Chang-Meng Wang is vice president and Jen-Yio Shiu is assistant manager for the manufacturing and engineering department at Shenmao Technology Inc. Hsiang-Chuan Chen is section manager and Ya-Ching Chuang is the senior researcher for the Advanced Material Development Center at Shenmao Technology Inc. Researchers at the University of Adelaide have developed a method for embedding light- emitting nanoparticles into glass without losing any of their unique properties—a major step towards "smart glass' applica- tions such as 3D display screens or remote radiation sensors. This new "hybrid glass" suc- cessfully combines the proper- ties of these special luminescent nanoparticles with the well- known aspects of glass, such as transparency and the ability to be processed into various shapes in- cluding very fine optical fibers. "These novel luminescent nanoparticles, called upconversion nanoparticles, have become promising candi- dates for a whole variety of ul- tra-high tech applications such as biological sensing, biomedi- cal imaging and 3D volumetric displays," says lead author Dr. Tim Zhao, from the University of Adelaide's School of Physical Sci- ences and Institute for Photonics and Advanced Sensing (IPAS). Although this method was developed with upconversion nanoparticles, the researchers believe their new "direct-doping" approach can be generalized to other nanoparticles with interesting photonic, electronic and magnetic properties. Glass Now Has Smart Potential A NEW DISPENSING SOLDER PASTE FOR LASER SOLDERING TECHNOLOGY

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