SMT007 Magazine


Issue link:

Contents of this Issue


Page 3 of 123

4 SMT Magazine • July 2016 This month, SMT Magazine discusses test and inspection technologies that help identify PCB assembly defects for the improvement of associated manufacturing processes. PCBA Test and Inspection Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements by K. Tellefsen, et al. Addressing New Testing and Inspection Challenges Interview with NK Chari Condensation Testing— A New Approach by Chris Hunt, Ling Zou, and Phil Kinner Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth by Jens Mille and Jens Kokott Package-on-Package Warpage Characteristics and Requirements by Wei Keat Loh and Haley Fu Standardizing Platforms from Characterization to Production by Matej Krajnc 16 26 38 56 68 80 July 2016 • Featured Content 56 80 16 68 M A G A Z I N E 26 38

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT-July2016