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98 SMT Magazine • July 2016 for the laser cut sidewall (Figure 15). The varia- tion is too small to expect significant issues. Pin-point EDX Analysis Additional EDX probing was done on cut walls of boards with different thicknesses and with differences in laser system setups. From those, ones were selected for an 800 µm board (33 mil) cut with setup conditions as in Table 1 and comparing those to a cut made in a similar board which was depaneled with a router. A finely focused beam was used to be able to measure the chemical components on the epoxy and also on the glass fibers. In the tests, probes 3 and 4 are done with different cooling Figure 15: Untreated laser-cut sidewall. Figure 16: Inspecting epoxy areas. Figure 17: EDX analysis epoxy area. Table 1. Comparison between cut walls of boards with setup conditions and boards depaneled with a router. MATERIAL EFFECTS OF LASER ENERGY