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6 The PCB Magazine • August 2016 ARTICLE Factors Affecting the Adhesion of Thin Film Copper on Polyimide by David Ciufo, Hsin-Yi Tsai and Michael J. Carmody COLUMNS Speak Up! by Patty Goldman Building Reliability into the PCB, Part 2 by Michael Carano Welcome Your Product to the Real World! by Keith M. Sellers Embrace Your Brand by Barry Lee Cohen SHORTS Delivering the Next Generation of Connected Clothing Hey Robot, Shimmy Like a Centipede Nagji Sutariya, Industry Veteran and Beloved Figure, Passes Away Electronic Nose Smells Pesticides and Nerve Gas More Content 86 8 76 82 96 22 65 75 98 30 58 80 100 102 103 August 2016 Vol. 6, No. 8 thepcbmagazine.com HIGHLIGHTS Supply Line EIN & Market News MilAero007 Top Ten PCB007 DEPARTMENTS Events Calendar Advertisers Index & Masthead 86 76 82

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