Issue link: https://iconnect007.uberflip.com/i/721932
September 2016 • SMT Magazine 107 ing Technologies, Vol. 31, Issue 2, 2008. 4. Ghaffarian, R. "CCGA Packages for Space Applications," Microelectronics Reliability 46 2006–2024, 2006. 5. Fjelstad, J., Ghaffarian, R., and Kim, Y.G., Chip Scale Packaging for Modern Electronics, Electrochemical Publications, 2002. 6. The Value of C-SAM® Acoustic Micro Im- aging (AMI), accessed Jan 27, 2014. 7. Sandor, M., Agarwal, S., Using Nonde- structive Methods (C-SAM) for COTS PEMs Screening and Qualification, CMSE, Feb. 2001, Accessed Jan. 27, 2014. 8. Kostic, A.D., Schwartz, S.W., "Optimized Acoustic Microscopy Screening for Multilayer Ceramic Capacitors," Proceedings of Reliability and Maintainability Symposium (RAM), 2011, pp. 1-4. 9. Semmens, J. Flip Chips and Acoustic Mi- cro Imaging: An Overview of Past Applications, Present Status, And Roadmap for the Future, ac- cessed Jan 27, 2014. 10. Kessler, L.W., Probing Flip-Chip Interfac- es, March 1, 2006, accessed Jan 27, 2014. 11. Sakuma, K., Smith, K., Tunga, K., Perec- to, E., Wassick, T., Pompeo, F., Nah, J., "Differ- ential Heating/Cooling Chip Joining Method to Prevent Package Interaction Issue in Large Die with Ultra Low-K Technology," Electronic Com- ponents and Technology Conference (ECTC), 2012. 12. Phommahaxay, A., et al, "High-Frequen- cy Scanning Acoustic Microscopy Applied to 3D Integrated Process: Void Detection in Through Silicon Vias," Electronic Components and Tech- nology Conference (ECTC), 2013. 13. Czurratis, P., Djuric, T., Hoffrogge, P., Phommahaxay, A. De Wolf, I., New Scanning Acoustic Microscopy Technologies Applied to 3D Integration Applications, accessed, Nov. 21, 2015. Dr. Reza Ghaffarian is a principal engineer at NASA's Jet Propulsion Laboratory (JPL). DEFECT FEATURES DETECTED BY ACOUSTIC EMISSION Purdue University is leading part of an international effort to develop a system for the military that would detect doc- tored images and video and determine specifically how they were manipulated. The project is funded over four years with a $4.4 million grant from the U.S. Defense Advanced Research Projects Agency (DARPA). The research also in- volves the University of Notre Dame, New York University, University of Southern California, Uni- versity of Siena in Italy, Politecnico di Milano in Italy, and University of Campinas, in Brazil. Edward Delp, Purdue's Charles William Harri- son Distinguished Professor of Electrical and Com- puter Engineering and the director of the Video and Image Processing Laboratory, or VIPER Lab, is the team's principal investigator. The team's co- principal investigators are Walter Scheirer, Kevin W. Bowyer, and Patrick J. Flynn from the University of Notre Dame; Anderson Rocha from the Univer- sity of Campinas in Brazil; C.C. Jay Kuo from the University of Southern Califor- nia; Paolo Bestagini and Stefano Tubaro at Politecnico di Milano in Italy; Mauro Barni at the University of Siena in Italy; and Nasir Memon at New York Univer- sity. A huge volume of images and video of potential intelligence value are up- loaded daily to the Internet. However, visual media are easily manipulated using software tools that are readily available to the public. The research- ers will strive to create an "end-to-end" system capable of handling the massive volume of media uploaded regularly to the Internet, that will auto- matically perform processes needed to verify their authenticity. The aim is not only to verify whether a particular digital object has been tampered with, but also to learn key aspects related to its digital lineage over time, a field known as "multimedia phylogeny". System Might Detect Doctored Images and Videos for the Military