Issue link: https://iconnect007.uberflip.com/i/721932
82 SMT Magazine • September 2016 manual material verification and exchange events, key tools, including gloves, guides, etc. – Reflow: Including profile ID or name actual parameters (e.g., temperature, speed, etc.) recorded, indication of how the profile was developed, cooling profile beyond machine down to ambient condition – Wave Solder/Selective Solder: including profile, fixture ID, actual temperature/speed readings, chemical composition of solder pot, etc. – Manual Visual Inspection: including actions taken, pass/fail, specific defects, acceptance criteria, magnification used, etc. – Automated Optical Inspection (AOI) and X-Ray Inspection: including pass/ fail, specific defects, full test result capture, false reject rate, acceptance criteria, retained images, etc. – In-Circuit Test: including fixture ID and revision, pass/fail, full parametric test result capture, fixture cycle count – Press Fit Operations: including manual material exchange event, tooling ID, profile name, actual insertion force or pressure, speed – Touch-Up: including all rework and touch-up recorded, tooling ID, tip size/ shape, iron temperature, mass reflows cycles – Encapsulation: including speed, cure time and temperature, vibration settings – System Assembly (Final Assembly): including tooling ID, torque measurement, last calibration/ verification – Mechanical Assembly Operations (includes robots): including manual material exchange event, tooling and fixture IDs, torques driver ID, critical parameters for hold times, pressures, cure times, etc., for adhesives, conformal coatings, under-fill, heat sink pressure pads, etc. – Software/Firmware Programming: including pass/fail, checksum recorded – Quality Assurance Check/Test/ Inspection: including pass/fail, defects recorded – Repair/Rework Station: including tooling IDs, settings and recipes, tooling details and configurations, repair method—preparation (for example cleaning), testing during/after repair – Functional Test: including definition of test, pass/fail, details of test parameters, results capture – Burn-In/Extended Test: including pass/ fail, static/dynamic, temperature/time profile, parametric test results – Shipping/End User/Post Manufacturing Environment Test: including drop-test, shipping profile test, humidity & temperature & pressure, pass/fail, test profile, parametric test results – Packing and Shipping: including quantity, weight, carrier, serial numbers, shipping destination, specific material configuration, shock monitor ID & setting (limit values) • Process Deviations: These are deviations for a range of products which have been planned in advance, deviation number (incident number), customer approval • Labelling: Unique label information, image of applied key label(s) • Exceptions: These are unplanned devia- tions (i.e., smoke, dust, high-temperature conditions or any other environment issues) which have affected one or more products which caused mitigating action to be taken. Details can include exceptions encountered, such as wiped PCB due to misprint, hand placed part normally machine placed, work-order processed with known shortage, process step performed out of sequence • Non-conforming items: Identify and document the nonconformance condi- tion of affected items. Records include the inspection results, evidence of perfor- mance of required test or inspection, extent of nonconformance, disposition of nonconforming items, and responsibility for corrective action. The items shall be positively identified to permit recall in IPC-1782 STANDARD FOR TRACEABILITY SUPPORTING COUNTERFEIT COMPONENT DETECTION