Issue link: https://iconnect007.uberflip.com/i/726276
60 The PCB Design Magazine • September 2016 The second good layout has a base of 10 thermal vias. Analysis results shows that the thermal junction maximum temperature is 45.5°C (+0.5°C). 0.87 W is transferred by con- duction into the PCB top layer by pin4. The rest, 0.13 W, is transferred outside the junction through pins 1-2-3 by conduction or outside the encapsulant by convection (Figure 11a). 0.57 W is transferred into the TIM through the 10 thermal vias (Figure 11b). The same benefit Figure 10: Good layout with 15 thermal vias, and the percentage of thermal vias usage for the 0.6 W transferred by vias. Figure 12: Good layout with five thermal vias, and the percentage of thermal via usage for the 0.48 W transferred by vias. Figure 11: Good layout with 10 thermal vias, and the percentage of thermal via usage for the 0.57 W transferred by vias. Figure 13: Improved layout with 10 thermal vias, and the percentage of thermal via usage for the 0.71 W transferred by vias. THE FUNDAMENTALS OF IMPROVING PCB THERMAL DESIGN