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4 SMT Magazine • November 2016 This issue of SMT Magazine looks into the impact of vias on PCB assemblies. The Via Issue The Impact of Via and Pad Design on QFN Assembly by David Geiger, Anwar Mohammed and Jennifer Nguyen The Taken-for-granted Via by W. Scott Fillebrown How to Improve PCB Reliability by Patrick McGoff To Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly by Yash Sutariya 16 36 48 60 November 2016 • Featured Content 16 M A G A Z I N E 48 36 60

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