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November 2016 • SMT Magazine 21 the conveyor speed was kept constant for all the profiles. The actual reflow profiles were similar and had the reflow time of around 60 seconds, the soak time of around 70–80 seconds and the peak temperature between 240° to 245°C. The profiles for 1.6 mm, 2.4 mm and 3.2 mm thick board were shown in Figure 4, 5 and 6, respec- tively. THE IMPACT OF VIA AND PAD DESIGN ON QFN ASSEMBLY Figure 4: Reflow profile of 1.6 mm thick board. Figure 5: Reflow profile of 2.4 mm thick board.