SMT007 Magazine

November 2016 • SMT Magazine 25 THE IMPACT OF VIA AND PAD DESIGN ON QFN ASSEMBLY Figure 8: Solder protrusion images for 8, 9, 12, and 20 mil reflowed using 1.6 mm thick board. Figure 10: Solder protrusion images for 8, 9, 12, and 20 mil reflowed using 3.2 mm thick board. Figure 11: Visual images of solder at the second- ary side for through hole via with no solder mask and for through hole via with solder mask ring around the via. Figure 9: Solder protrusion images for 8, 9, 12, and 20 mil reflowed using 2.4 mm thick board.

• Cover
• Featured Content — The Via Issue
• More Content
• Column — The Impact of Vias on PCB Assembly
• Short — Millennials in Manufacturing
• Column — The Theory Behind Tin Whisker Phenomena, Part 5
• Feature — The Impact of Via and Pad Design on QFN Assembly
• Short — Flexible Optical Design Method for Superconducting Nanowire Single-Photon Detectors
• Supply Lines Highlights
• Feature — The Taken-for-Granted Via
• Column — Smart for Smart's Sake, Part 2: Material Management
• MilAero007 Highlights
• Feature — How to Improve PCB Reliability
• EIN Market Highlights
• Feature — The Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly
• Column — Leadership in Your Company: Something to Worry About?
• Short — Engineers Design Ultralow Power Transistors That Could Function for Years Without a Battery
• Interview — Increasing Reliability Through Predictive Analysis
• HKPCA's Daniel Chan on China's PCB Manufacturing and Technology Landscape
• HKPCA & IPC Bring Hand-Soldering Competition World Championships to China
• Interview — Achieving the Smart Factory Vision
• Short — Scientists Gain Insight on Mechanism of Unconventional Superconductivity
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index & Masthead