12.5 :1 Aspect Ratio Used with Controlled Depth Drilling
H O L E F I L L I N G A T T A I Y O
T H P
®
- 1 0 0 D X 1 ( H T G )
Thermal Curable Hole Plugging Ink
High Tg (173°C) and Low CTE (20/56 ppm)
100% Solids for Extremely Low Shrinkage
No Chemical Attack through Desmear
Halogen-Free and RoHS Compliant
High PCT and Thermal Resistance
Designed Specifically for Automated Hole Filling
Equipment and to Fill Small Vias Without
Voids and Sagging
Phone [775] 885-9959 • www.taiyo-america.com • info@taiyo-america.com
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OTHER HOLE FILL
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