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November 2016 • The PCB Magazine 67 3. IPC Test Methods Manual, IPC-TM-650, 2007. John Dangler is senior engineer at IBM in Rochester, Minnesota. Jeffrey Taylor is senior quality engineer at Lenovo in Research Triangle Park, North Carolina. Cynnthia Verbrugge is sales applications engineer with Amphenol in Minneapolis, Minnesota. UNIQUE IMPLEMENTATION OF A RIGID-FLEX CIRCUIT Figure 28 shows the scalability card installed with the mechanical hardware completing the interconnect between the two planar boards. Conclusions This rigid-flex design included several key el- ements, any of which on their own are a reason for special consideration. Together they were a significant challenge. By close collaboration be- tween the flex supplier, material suppliers and end user we successfully implemented an ele- gant workable solution to a complex problem that addressed all requirements. PCB References 1. Qualification and Performance Specifi- cation for Flexible Printed Boards, IPC-6013C, 2009. 2. Qualification and Performance Specifica- tion for Rigid Printed Boards, IPC-6012D, 2010. Figure 25: Two-blade system. Figure 27: Two-blade scalability card. Figure 28: Two-blade system with scalability card and hardware installed. Figure 26: Two-blade system close-up.

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