16 The PCB Magazine • November 2016
examination would be completed in cross-sec-
tion using microsection analysis techniques—
as shown in many of the via structure images
within this article as well as, likely, in your past
experiences.
Ultimately, the via is a simple but critical
structure used in the construction of printed
circuit boards and understanding the options
available can be especially helpful when de-
signing a product. This column is a very brief
introduction into the world of vias. As with
most things, a little due diligence can result in a
plethora of information (as you can read in my
October column!).
PCB
References
1. IPC T-50-Revision M Terms and Defini-
tions for-Interconnecting and Packaging Elec-
tronic Circuits
2. IPC-TM-650, method 2.6. 26A
3. IPC-TM-650, method 2.6.27
Keith M. Sellers is operations
manager with NTS in Baltimore,
Maryland.
VIAS FOR DUMMIES
Figure 5: Filled microvia.
Figure 6: Stacked microvias. Figure 7: Separation in a microvia.
