November 2016 • The PCB Magazine 33
3. Hertlein, W.G., Tornkvist, K., & smith, K.,
ED photo resist technology becomes a manu-
facturing process, Circuit World, Vol.27-Iss 3,
2001, pp. 6-14.
4. Goldman, Patricia and Schmidt, Tim,
"New Design Applications Made Possible
by
Utilizing a Positive Acting Electrophoretic
Photoresist," IPC's 2002 Designers Learn-
ing Symposiums, Dallas, TX (May) and Toronto
(October).
5. Holden, H.,"Against the Density Wall:
Landless Vias Might be the Answer," June, 2016,
The PCB Magazine (pps. 12-22).
6. Pfeil, Charles and Holden, Happy, "Eight_
Key_HDI_Design_Principles,_Part_2," CircuiT-
ree magazine, March, 2011.
7. "BGA Breakouts and Routing," written by
Charles Pfiel. Free PDF download available here.
8. "HDI Handbook," written by Happy Hold-
en, et al. Free PDF download available here.
9. Holden, H.T., "A Design Technology Inno-
vation-The Power Mesh Architecture for PCBs,"
The Board Authority, Vol.2, #1, Dec. 2000, Cir-
cuiTree Magazine.
Happy Holden has worked in
printed circuit technology since
1970 with Hewlett-Packard,
NanYa/Westwood, Merix, Foxconn
and Gentex. Currently, he is the
co-editor, with Clyde Coombs, of
the Printed Circuit Handbook,
7th Ed. To view past columns or to contact
Holden, click here.
Figure 13: Single (a) and split plane (b) PDN for multilayers with (c) the power mesh architecture
modeled as (d) offset coplanar stripline and (d) impedances of this structure
[9]
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INNOVATIVE USE OF VIAS FOR DENSITY IMPROVEMENTS
