Issue link: https://iconnect007.uberflip.com/i/746712
November 2016 • The PCB Magazine 59 UNIQUE IMPLEMENTATION OF A RIGID-FLEX CIRCUIT Figure 6: Alternate stack-up without cutback coverlay/acrylic bonding film (not used). Figure 7: Microsection of flex/rigid transition zone and rigid section (with vias). lay/acrylic bonding film which would have put 8 mils of acrylic adhesive in the via area, which is not preferred per previous discussion and was not used. Figures 7 and 8 show microsections of the final product. Figure 9 shows a microsection of vias in the rigid area.