SMT007 Magazine

Oxide RESIDUE icicles ELECTRA MIGRATION to be continued... Are these villains wreaking havoc on your processes? ©2017 Indium Corporation Then you need Email: askus@indium.com Learn more: indium.com/99/SMTUS Visit us at IPC APEX: Booth 1011

• Cover
• Featured Content — Plating and Surface Finishing
• More Content
• Column — Understanding Plating and Surface Finishing
• Feature — Evaluation of the Use of ENEPIG in Small Solder Joints
• Column — Smart for Smart's Sake, Part 3: Unification & Traceability
• Short — Honey, I Shrunk the Circuit
• MilAero007 Highlights
• Feature — Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
• Column — Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices
• Short — Advance in Intense Pulsed Light Sintering Opens Door to Improved Electronics Manufacturing
• Supply Lines Highlights
• Feature — Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating—Influence of Electroless Pd Plating Film Thickness
• Column — Reducing Warpage on BGAs During Rework
• Short — Spin Filtering at Room Temperature with Graphene
• EIN Market Highlights
• Feature Interview — Plating and Surface Finish: Assemblers' POV
• Column — A New Organizational Model Using Logic, Cost Effectiveness and Customer Service, Part 2
• Article — Breaking Down the Long, Complex Sales Cycle in the EMS Industry
• Column — Got Whiskers?
• Short — Meeting Current and Future Requirements of the Automotive Industry
• Article — The Influence of Clean Air on the Value-Added Chain in Electronics Production
• Short — Millennials in Manufacturing 101: How to Get Millennials to Join Your Electronics Manufacturing Company
• Article — Choosing the Correct Flux—Advantages/Disadvantages
• Short — Real Time With…HKPCA & IPC Show 2016: IPC Hand Soldering World Championship in China
• Top Ten Recent Highlights from SMT007
• Events Calendar