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4 The PCB Magazine • January 2017 So what is new in plating and surface finishes? This month, our experts weigh in on new processes, the tried-and-true old processes, R&D, and how to go about choosing the right process from among all those available today. January 2017 Featured Content Plating and Surface Finishes FEATURES: Study of Immersion Gold Processes Used for Both ENIG and ENEPIG by Don Gudeczauskas, Albin Gruenwald and George Milad Acid Copper Plating—Understanding What's Often Taken for Granted by Michael Carano Electroplated Copper Filling of Through-holes: Influence on Hole Geometry by Ron Blake, Andy Oh, Carmichael Gugliotti, Bill DeCesare, Don DeSalvo, and Rich Bellemare FEATURE COLUMNS: Final Surface Finish: How Do You Choose? by Tara Dunn Plating and Surface Finish: The Challenges to Electrical Test by Todd Kolmodin ENIPIG–Next Generation of PCB Surface Finish MACFEST Dissemination Webinar, December 2016 by Pete Starkey 16 34 46 12 28 60 34 60 46 28 12

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