SMT007 Magazine

Oxide RESIDUE icicles ELECTRA MIGRATION to be continued... Are these villains wreaking havoc on your processes? ©2017 Indium Corporation Then you need Email: askus@indium.com Learn more: indium.com/99/SMTUS Visit us at IPC APEX: Booth 1011

• Cover
• Featured Content — New Technologies
• More Content
• Column — Survey Says: New Technology!
• Feature — In Pursuit of 4.0
• Short — CES 2017: Disruptive Technologies
• Feature Interview — Alpha on New Technologies to Tackle Voiding
• Short — Help Wanted! Our 2017 Industry Hiring Survey
• MilAero007 Highlights
• Feature — The Shape of Things to Come
• Short — Emmy Ross Discusses the New I-Connect007 E-Book Series
• Feature Interview — Electrolube Highlights Latest Technologies Targeted at Automotive, LED Applications
• Short — Millennials in Manufacturing: Tom Scales—Manufacturing from an IT Perspective
• Feature — What's Driving the Rapidly Changing Electronics Assembly Industry
• Supply Lines Highlights
• Feature Interview — GOEPEL electronic Talks Test and Inspection Innovations
• Article — The New IPC Standard for Traceability Makes Compliance and Reporting Easier
• Column — A New Organizational Model Using Logic, Cost Effectiveness and Customer Service, Part 3
• EIN Market Highlights
• Article — Bringing SMT Assembly In-House: Case Study of the Effects on Lead Time, Inventory, Quality, and Overall Cost
• Article — Taking the "Process Approach" to RFQs in Electronics Contract Manufacturing
• Interview — VirTex Discusses EMS Challenges, New Technologies and Trends
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead