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4 The PCB Design Magazine • February 2017 Technological innovations have been coming at us so fast that it's often difficult to keep track of them. We asked our contributors to discuss new technology that they were excited about. In this issue, Douglas G. Brooks, PhD, focuses on a variety of experiments conducted with the Thermal Risk Management (TRM) tool, such as find- ing the temperature inside the barrel of a via. Columnist Barry Olney of In-Circuit Design explains how his new iCD Design Integrity platform can make PCB designers much more productive. Dingru Xiao of Cadence Design Systems discusses new tool options that integrate the functions needed by power integrity engineers and PCB designers in one platform. And columnist Tim Haag of Intercept Technology wonders if PCB designers will ever be able to design boards with a hologram, just like the one in the first "Iron Man" movie. February 2017 Feature Content New Technology Exciting New Technology: Thermal Risk Management by Douglas G. Brooks, PhD A New Power Design Methodology for PCB Designs by Dingru Xiao FEATURE COLUMNS New Functionality Improves Designer's Productivity by Barry Olney Design Tools of Tomorrow: A Real "Marvel" by Tim Haag 12 22 30 40 22 40 12 30

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