SMT007 Magazine

www.iwlpc.com 2017 14 th International Wafer-Level Packaging Conference Contact Jenny Ng jenny@smta.org 952-920-7682 Call for Participation The International Wafer-Level Packaging Conference Technical Commitee invites you to submit an abstract for presentations, posters and workshops. Abstracts Deadline: April 10, 2017 *Technical papers are required* Submit online www.iwlpc.com Suggested Topics Wafer-Level Packaging 3D Packaging Integration Advanced Integrated Systems and Devices Advanced Wafer-Level Manufacturing and Test October 24-26, 2017 DoubleTree by Hilton San Jose, CA Orgnaized by:

• Cover
• Featured Content — The Wide World of Flex Circuit Assembly
• More Content
• Column — Navigating the Complex World of Flex Circuit Assembly
• Feature — Assembly of Flexible Circuits
• Short — Real Time with…IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0
• MilAero007 Highlights
• Feature Interview — Strategies for Addressing Flex Circuit Assembly Pain Points
• Short — Achieving Successful Flex Circuit Asemblies
• Column — One Size Fits All?
• Feature — Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly
• Supply Lines Highlights
• Feature Column — Rework and Repair on Flex Circuits
• Feature Interview — JSS Stresses the Need for Baking Prior to Flex-Circuit Assembly
• Short — Real Time with…IPC: Alpha Discusses Improving LED Reliability Issues
• EIN Market Highlights
• Feature Interview — Fixturing: Key to Accurate Flex Circuit Assembly
• Short — Real Time with…IPC: BEST Talks Rework Challenges and Opportunities
• Column — A New Organizational Model Using Logic, Cost-Effectiveness and Customer Service, Partt 4
• Short — Metcal Brings Big Science and High Reliability to Hand Soldering
• Feature Interview — Flex-Circuit Assemby Success Hinges on MSL Control and Panelization
• Short — Real Time with…IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market
• Column — Prodrive Technologies: 4.0 in Action
• Short — Real Time with…IPC: CalcuQuote on Risk Assessment and RFQ Management
• Article — Evaluating a PCB Assembler
• Short — IPC APEX EXPO 2017 Coverage with I-Connect007
• Article — Miniature Components on PCBs Requires Flexible Cleaning Methods
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead
• Back Cover