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36 The PCB Magazine • March 2017 dow tests, test lots, and eventually going into production, as seen in Figure 3. For processes to eventually be used with pat- terned material and small internal-layer capture pads, the process developed on equivalent un- patterned material would then be revalidated on this patterned material in order to validate accuracy and any process shifts due to the dif- Figure 2: Example of a broad process sweep to find a robust through-via process. Figure 3: Example flowchart for process development. STEPPING UP TO LASER PROCESSING FOR FLEX, PART 5: PROCESS DEVELOPMENT