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March 2017 • The PCB Magazine 81 MACFEST: BENCHMARKING A NEW SOLDERABLE PCB FINISH Conclusions and Future Studies The performance of the new ionic liquid- ENIPIG finish was benchmarked against widely applied surface finishes for the PCB industry, where its performance was exemplary in terms of the solder-ability. One of the uses of the ENIPIG finish is for high-density circuit builds with small feature sizes. To connect the PCB to the small pad fea- tures on the integrated circuit component, wire bonding is required. Trials are being developed for the remainder of the project, looking to test Figure 6: Example of solder spot test. Top shows solder spots added to tracks with reducing distance between features. Bottom shows coalesced spots after reflow heating of board. Figure 7: Solder spot wetting test results for different plated finishes and processing conditions.