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6 SMT Magazine • June 2017 S H O RT S RTW NEPCON China: Data I/O on Securing the Supply Chain Ballistic Nanowire Connections, A Potential Future Key Component for Quantum Computing Miniatured 'Heat Engines' Could Power Nanoscale Machines of the Future RTW NEPCON China: Mycronic Meets High-Volume Demand With Solder Jet Printing New I-007 eBook—The Printed Circuit Designer's Guide to... Secrets of High-Speed PCBs—Part 2 LCN Collaborates in IARPA-Funded QEO Program Conductive Paper Could Enable Future Flexible Electronics I N T E RV I E W Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends Interview with Ivan Li CO L U M N S The Need for 3D AOI by Stephen Las Marias Long-Term Storage of Electronic Components and Compositions by Rich Heimsch Reading, Writing, Listening, Speaking and Analyzing Material Cost in the Global Economy, Part 1 by Tom Borkes H I G H L I G H T S MilAero007 Supply Lines Markets Top Ten Recent Highlights from SMT007 D E PA RT M E N T S Career Opportunities Events Calendar Advertiser Index & Masthead 80 8 42 62 22 30 54 92 86 94 95 More Content: 42 62 S M T M AG A Z I N E • J u n e 2 0 17 • Vo l . 3 2 , N o . 6 • s m t m a g a z i n e . c o m 10 40 45 60 68 79 84 80

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