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60 SMT Magazine • June 2017 Las Marias: Previously, manufacturers say inspec- tion doesn't add any value. But nowadays, there is an increasing effort to install inspection systems in electronics assembly lines. What has changed? Kim: The main change is the size of the com- ponent and the density of the component. Pre- viously, the components were bigger, so in- spection can be done by operators without any problem. However, component sizes now have become smaller and smaller, and PCB assem- blies have become denser. It's very difficult to control the production and therefore the de- fects. It's necessary to use an automated inspec- tion system. However, it also leads to another issue. If the equipment isn't accurate, it causes more false calls, therefore the operator still must check whether the false calls are indeed false calls or a real defect. For customers, it means higher cost and more human resources. Just because you are using an automated optical inspection sys- tem doesn't mean your inspection is good. You need to use the accurate equipment to save you cost. Las Marias: Having said that, what are the key factors to consider when it comes to 3D AOI? Kim: Customer now are using very small-sized chips and components, so they should check whether 3D AOI is the type of the tool that can inspect for defects from the small sized com- ponents—which the normal 2D AOI couldn't check properly. That's the first one. Second, the labor cost is increasing nowadays, so customers should use an automated system without too many false calls to make their work easier and simpler. Now, we are even targeting automated programming and automated fine tuning. Even- tually we think we can realize unmanned pro- duction by AI technology. So that's also the rea- son why we are putting a lot of resource into de- veloping our AI technology, not just the equip- ment itself. Las Marias: Scott, is there anything else you would like to talk about? Kim: Other than the software and some accu- rate machine performance, we still have many new applications that can deliver good benefits for the customers. For example, we introduced a new feature in the SPI system. Conventionally, the inspection system only checks for defects, but this time, we delivered a solder dispensing solution with SPI, in which the SPI inspects the defect, for example, in soft shell solder or no solder pad. And then it can dispense solder and improve the solder joint. This can help improve the production yield. Las Marias: Scott, thank you very much for your time. Kim: You're welcome. SMT KOH YOUNG DISCUSSES LATEST 3D AOI INNOVATIONS Mycronic VP for Global Dispensing and Managing Di- rector Clemens Jargon discusses how the flexibility of sol- der jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand. Jargon also focuses on their recent acquisition of Chi- na-based Shenzhen Axxon Automation Co. Ltd; the differ- ence between the quality of yields in stencil printing and jet printing technologies; and their Industry 4.0 strategy. Watch the interview here. RTW NEPCON CHINA: Mycronic Meets High-volume Demand With Solder Jet Printing

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