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June 2017 • The PCB Magazine 35 EMBEDDING ACTIVE AND PASSIVE COMPONENTS IN ORGANIC PCBS age components or would result in conductive surface contamination between the conductor and the solder lands. In addition, compared to air, the epoxy glass-reinforced CCL has a more than 10x better heat dissipation. This allows the components to operate at lower temperatures. Important Note To achieve these benefits, an excellent co- operation between the printed circuit board fabricators, the electrical designer, the PC board layout engineer, the laminate fabricators and the component suppliers, as well as the assem- bly specialist and test engineers is mandatory to achieve high first-pass yield. In addition, it is required to manage the supply chain and to get new components and known good bare dies. The total information sharing from design rules and expected innovative results may impact the total supply chain and will influence the minia- turization potential and the yield and reliability of the electronic devices with embedded device technology. To achieve these goals to our and the end user´s satisfaction, it was required to es- tablish our in-house assembly department with the capability of handling thin core PCBs and very small devices during the total fabrication process. Application Examples Thermal management heat dissipation In-house test at Hofmann Leiterplatten fac- tory has shown that the temperature at of MOS- FET components assembled on the outside sur- Figure 2: A typical roadmap for embedded devices used by Hofmann Leiterplatten. Figure 3: The fabrication process for embedding devices in PCBs, Part 1.

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