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40 The PCB Magazine • June 2017 ties for a cost-effective PCB used in conjunction with electronic components with high power application. Each component has its own geometrical shape and dimension, each resin has its own flow characteristic and each multilayer press and press cycle has its own press profile and heat dissipation. Therefore, it is necessary to understand the epoxy resin flow properties and the capability to encapsulate the components with a homogeneous epoxy embedding resin. Projects Utilizing the AML Device Embedding Technology Some products that have been manufac- tured are not under any non-disclosure agree- ment (NDA). Most of the present new develop- ments are under NDAs with our key customers. As our company is focusing on new technology based on PCB fabrication technology, we must get involved in many new projects at a very early stage of the product development process. Confidentiality is a key element in joint prod- uct development for the success of our custom- ers and our company. In the beginning, we very much depended on a friendly EMS fabricator to assemble our components to the thin core CCL innerlayers. When components were large, this was still an option. However, when components became smaller and delivery times for development projects were under a tight time frame, we in- EMBEDDING ACTIVE AND PASSIVE COMPONENTS IN ORGANIC PCBS Figure 9: Present technology limitations of the AML technology. Figure 10: Primary AML fabrication challenges. Figure 11: Products using the device embedding fabrication technology by Hofmann Leiterplatten GmbH.