Issue link: https://iconnect007.uberflip.com/i/834021
38 The PCB Magazine • June 2017 Holes and vias In the case of an AML PCB, it should be not- ed that no through-holes or vias are placed in the areas of the components. For vias or holes, a distance of at least 0.5 mm from the periphery of the drilling to the SMD land of the adjacent component should be maintained. Distance from components and package density When designing the layout, please note that the component areas, the surfaces intend- ed for the inner layer assembly, occupy only a maximum of 40% of the circuit board area. The component area is defined by the component, EMBEDDING ACTIVE AND PASSIVE COMPONENTS IN ORGANIC PCBS Figure 5: Heat dissipation improvement using device embedded technology. Figure 6: Device embedded components are resistant to any liquids that are resistant to standard PCB CCL based on epoxy resin. Figure 7: A sensor PCB with two layers of embedded components.