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78 The PCB Design Magazine • June 2017 1 Mentor OSAT Alliance Streamlines IC High-Density Advanced Packaging Design and Manufacturing Mentor has launched the Mentor OSAT (Outsourced Assembly and Test) Alli- ance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer inte - grated circuit (IC) designs. 2 SnapEDA: Recruiting Top Engineering Talent in an Amazon World You don't have to love EDA to work at SnapEDA, but it helps. This startup, founded by Natasha Baker, is on its way to creating the world's largest parts library for PCB designers. Baker leads a small team of young, fiercely talented engineers—the kind of employees that are attractive to companies like Google and Facebook. I asked Natasha to explain her hiring process, and how she ensures that each employee is the right fit for SnapEDA. 3 I-Connect007 Launches "The Printed Circuit Designer's Guide to…Secrets of High-Speed PCBs – Part 2" Micro eBook The latest title in this new line of eBooks, The Printed Circuit Designer's Guide to… Secrets of High-Speed PCBs – Part 2, is au- thored by Martyn Gaudion of Po- lar Instruments. Following on Part 1, this edition examines issues such as laminate loss, differential insertion loss, impedance control, modelled vs. measured results, and much more. 4 Steve Robinson Discusses APCT's Tenfold Expansion Steve Robinson, CEO of APCT, a PCB fabricator in Silicon Val- ley, has led the company to impressive growth since he ac- quired it nearly 10 years ago. I ran into Steve at DesignCon 2017, and we sat down to dis- cuss the company's remark- able transformation and his focus on working with PCB designers and engineers to create advanced, high-speed PCBs. TOP TEN Recent Highlights from PCBDesign007

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