78 The PCB Design Magazine • June 2017
1
Mentor OSAT Alliance
Streamlines IC High-Density
Advanced Packaging Design
and Manufacturing
Mentor has launched the
Mentor OSAT (Outsourced
Assembly and Test) Alli-
ance program to help drive ecosystem capabilities
in
support of new high-density advanced packaging
(HDAP) technologies like 2.5D IC, 3D IC and fan-out
wafer-level packaging (FOWLP) for customer inte
-
grated circuit (IC) designs.
2
SnapEDA: Recruiting Top
Engineering Talent in an
Amazon World
You don't have to love EDA to
work at SnapEDA, but it helps.
This startup, founded by Natasha
Baker, is on its way to creating
the world's largest parts library
for PCB designers. Baker leads
a small team of young, fiercely
talented engineers—the kind of
employees that are attractive to companies like
Google and Facebook. I asked Natasha to explain
her hiring process, and how she ensures that each
employee is the right fit for SnapEDA.
3
I-Connect007 Launches "The
Printed Circuit Designer's Guide
to…Secrets of High-Speed PCBs –
Part 2" Micro eBook
The latest title in this new line
of eBooks, The Printed Circuit
Designer's Guide to… Secrets of
High-Speed PCBs – Part 2, is au-
thored by Martyn Gaudion of Po-
lar Instruments. Following on Part
1, this edition examines issues
such as laminate loss, differential
insertion loss, impedance control,
modelled vs. measured results, and much more.
4
Steve Robinson Discusses
APCT's Tenfold Expansion
Steve Robinson, CEO of APCT,
a PCB fabricator in Silicon Val-
ley, has led the company to
impressive growth since he ac-
quired it nearly 10 years ago.
I ran into Steve at DesignCon
2017, and we sat down to dis-
cuss the company's remark-
able transformation and his focus on working with
PCB designers and engineers to create advanced,
high-speed PCBs.
TOP
TEN
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