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24 SMT Magazine • July 2017 consistencies. This is especially true when sus- pect counterfeit parts are mixed in the same de- livery packaging and 100% inspection is not performed. Finally, there was a measurement of pin width between the two different leads. The leads from the distributor parts were on the or- der of 14.5 mils wide, whereas the lead width from the broker parts was 12 mils. The differ- ence led to the next step in the investigation, namely X-ray. X-Ray A real-time X-ray inspection system, a com- mon instrument used in manufacturing from incoming inspection, through assembly and failure analysis also comes in handy when per- forming investigations of suspect counterfeit parts. In this investigation, X-ray quickly re- vealed two different leadframes were being used for assembly of the memory device. Figure 3 shows not only design differences in the lead design but also the die paddle design. It is in- teresting to note that the broker shipped parts used the same leadframe design as the distribu- tor on one delivery date, while a different lead- frame three months later. The difference in lead- frame geometry could contribute to the electri- cal performance of the SRAM through contribu- tions of parasitics, including wirebond length and location. C-SAM C-Mode scanning acoustic microscopy (C- SAM) is another tool used to detect anomalies within an electronic device. It is a form of ultra- sound that uses cyclical sound waves to deter- mine density differences within a sample and has been demonstrated to be an effective anti- counterfeiting screening tool. C-SAM allows a planar view of the interfaces between materials with intent to determine delamination. Using COUNTERFEIT ELECTRONIC COMPONENTS IDENTIFICATION: A CASE STUDY Figure 2: Lead and mold inspection. Different mold interface and pin width. Figure 3: X-ray of leadframe with different lead and die paddle design.