28 The PCB Magazine • July 2017
Flying Probe Testing vs IPC-9252B
Flying probe testing is extremely popular in to-
day's manufacturing theatres. The main factor is
cost reduction in contrast to dedicated fixtures
and fixture testing. However, there are some
limitations in flying probe testing when gauged
against industry specifications—specifically, the
use of indirect vs direct testing in Test Level C.
A Twist on Printed Electronics:
Printing on 3D Shapes
Barry Matties speaks with Optomec's Pascal Pierra
about their LENS printer systems and aerosol Jet
technology, which allows manufacturers to print
applications like sensors and antennas on 3D ob-
jects. The process is significantly faster and green-
er than competing technologies.
Intrinsiq Materials and NovaCentrix
Unveil Ultra-Thin Printed Copper-Clad
Polyimide using Photonic Sintering for
HDI Applications
Intrinsiq Materials has partnered with NovaCen-
trix to create a high-performance, low-cost, cop-
per-clad polyimide without the use of adhesives
or time-consuming sputtering. These thin layers
cannot be produced by traditional lamination
processes.
Amphenol Invotec Invests in
Dynachem Lamination Technology
Amphenol Invotec has installed a state-of-the-art
Dynachem inner-layer dry film lamination line ca-
pable of handling 25 micron cores.
Meyer Burger Supplies CONx Microfab
R&D and Pilot Production System at
NextFlex
Meyer Burger, in partnership with DuPont, East-
man Chemical and Intrinsiq Materials, is deliver-
ing a CONx Microfab cluster tool that includes
two PiXDRO IP410 inkjet printing systems, a FLEx
LT PECVD deposition system, automation, and
on-board metrology that will enable multilayer,
multi-material additive depositions for complex
FHE structures.
Rogers Launches HeatSORB Thermal
Management Material
Rogers Corporation is pleased to announce the
introduction of HeatSORB, a proprietary phase
change material that addresses thermal manage-
ment challenges in portable electronics. Heat-
SORB is a unique material capable of consistent-
ly absorbing large amounts of heat within a very
specific temperature window.
Uyemura Expands US Pacific Rim
Service Capacity
Jose Alonzo Garcia is Uyemura's new technical
service engineer for a key territory that includes
Northern California, Washington, and Oregon.
The appointment was formalized May 8 by Uy-
emura Vice President Don Gudeczauskas.
Ventec International Expands UK
Clean-Room Manufacturing Capacity
Ventec International Group is upgrading the fab-
rication capability and capacity at its United King-
dom facility with an investment in a new state-of-
the-art equipment for copper foil cutting in a Class
10,000 (ISO 7) clean-room environment.
Engineers Develop Innovative Direct
Patterning Plating Technology
This technology does not require a vacuum en-
vironment or photoresist, and can directly form
low-resistance fine wires on a variety of materials
using a low-temperature process that can be per-
formed at or below 100°C.
Random Thoughts on Employment,
from Both Sides of the Table...
Many years ago, as I began my senior year of
college, the reality of getting a job slapped
me in the face! After three years of college
studies, it dawned on me that without a job
after graduation, all my hard work would have
been for naught. Luckily, my university had a
solid interview/job
program that helped me
and many of my fellow undergrads find gain-
ful employment upon graduation the following
spring.
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