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36 SMT Magazine • September 2017 by Joerg Nolte ERSA GMBH Introduction Rising customer demands in the field of PCB repair are a daily occurrence as the rapidly evolving electronics industry follows new trends in a blink of an eye. New strategies and technologies are required to fulfill those demands. Out of the long list of today's customer demands for efficient BTC and SMT PCB repair, some subjects show up on a daily basis and are generally agreed upon as relevant for the coming years: • BTC types with new effects: voidless treatment • Smaller components: miniaturization (01005 capability) • Large board handling: dynamic preheating for large board repair • Repeatable processes: flux and paste application (dip and print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability • Operator support: higher automation, software guidance (human computer interface) • Cost effectiveness: rework systems for different budgets and ROI situations Some of the listed topics above have not shown their practical relevance yet. There have been a number of discussions about 01005 rework capabilities, but up to now there is no proven evidence that those technologies that claim to be capable, can truly run successful rework processes on this tiny component in a daily real-world rework situation. Many parameters need to be observed and controlled in precision line-production, including: • desoldering and lifting of component without affecting very close neighbouring components • new selective solder paste supply for the small joints • picking, adjustment and placement of the component • PCB coating • PCB cleaning and others BTC and SMT Rework Challenges FEATURE

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