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September 2017 • SMT Magazine 39 voids, trapped in the boundary layer, the liquid solder, have the ability to escape. By this method, void reduction during new component installation down to void rates of 2% is possible (Figure 2). Even a significant void reduction can be achieved during a second reflow on an existing assembly. As in the case of a voidless rework treatment, only a selected area of the PCB is heated up to reflow and only this section is treated with the actuation, with no negative side effects to the assembly can be expected. Residual Solder Removal—Scavenging Other than in production, one important step during the repair of a printed circuit board BTC AND SMT REWORK CHALLENGES Figure 1: Voidless treatment of a PCB with piezo actuator. Figure 2: Actuation of a PCB during reflow, to reduce the void rate in an MLF (results before and after treatment).