SMT007 Magazine


Issue link:

Contents of this Issue


Page 76 of 105

Minimizes solder beading High ECM performance under low standoff components High print transfer efficiency with low variation Excellent wetting Very low bridging, slump, and solder balling Indium10.1HF Halogen-Free, No-Clean, Pb-Free S O L D E R P A S T E Contact our engineers today: Learn more: Click our video for more: Indium10.1HF <10% Void Area Typical Voiding >40% Void Area ©2017 Indium Corporation

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT-Sept2017