Minimizes solder beading
High ECM performance under low
standoff components
High print transfer efficiency with
low variation
Excellent wetting
Very low bridging, slump, and
solder balling
Indium10.1HF
Halogen-Free, No-Clean,
Pb-Free
S O L D E R P A S T E
Contact our engineers today: techsupport@indium.com
Learn more: www.indium.com/avoidthevoid/SMTUS
Click our video for more:
Indium10.1HF
<10% Void Area
Typical Voiding
>40% Void Area
©2017 Indium Corporation
