PCB007 Magazine

PCB-Oct2017

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October 2017 • The PCB Magazine 43 Lower Costs Advanced Packages Performance Improvements Improved Mechanicals Faster Time-to-Market • Reduces layers • Reduces size • Higher density at a lower cost • Product miniaturization • Increased wiring density • Higher layout efficiency • Faster layouts • Ease of use for BGAs • Required for flip chip • Essential for chip scale packages • Improved signal integrity • Lower RFI/EMI • Improved reliability • Increased thermal efficiency Details on Signal Integrity and HDI Electrical Performance The information in this section has been presented by experts such as Dr. Eric Bogatin [2,3] and Dr. Paul Franzon of NC State University [4] . (For further information, use the link to Dr. Bogatin's papers shown in references 2 and 3.) Signal integrity improvements are certain- ly available to all who take the time to respect Mother Nature. HDI's contribution comes mainly HDI'S BENEFICIAL INFLUENCE ON HIGH-FREQUENCY SIGNAL INTEGRITY Lower RFI/EMI In the realm of RFI/EMI, combining the increased routability area with the micro- vias' physical via-in-pad implementation allows designers to place more ground plane around components. By doing this, the size of ground return loops decreases and improved RFI/EMI per- formance is realized. Thin dielec- trics characteristic of HDI along with PWR/GND pairs also reduce EMI and radiations. More on this later in the article. Improved Thermal Efficiency The thin dielectric and high- er Tg of HDIS materials improved thermal performance. Many complex enhanced tape BGAs are made of thin, laser-drilled polyimide film. Greater Design Efficiency Microvias allow ease of part placement on both sides of an assembly and improved compo- nent escape routing (via-in-pad or swing-vias), leading to easier inner layer free space rout- ing and 100% completion by HDI auto-routers. New fine-pitch parts can easily be utilized. Faster Time-to-Market Microvia placement on both sides of an as- sembly makes placement and routing faster. Ei- ther manual or auto-routing, the blind/buried via stackup provides 2–4x greater routing density per signal layer, making routing easier and faster. These benefits are highlighted in Figure 1 [1] . Figure 1: Five major areas of HDI benefits. Table 1: HDI features and the SI problems they help solve [2,3] .

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