Issue link: https://iconnect007.uberflip.com/i/884055
October 2017 • The PCB Magazine 55 HDI'S BENEFICIAL INFLUENCE ON HIGH-FREQUENCY SIGNAL INTEGRITY Figure 14a: Component (side A) of the 10-layer HDI multilayer redesigned from an 18-layer through-hole multilayer. Figure 14b: Solder (side B) of the 10-layer HDI multilayer redesigned from an 18-layer through-hole multilayer. Figure 15: Cross-sections of the before and after versions of the high-performance, high-frequency multilayer board.